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Direct Heat Sink to Component Attachment Disclosure Number: IPCOM000051072D
Original Publication Date: 1982-Aug-01
Included in the Prior Art Database: 2005-Feb-10

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Campo, WA Ingraham, AP Rivenburgh, DL [+details]


There is a continuing need for better means of removing the heat generated in large-scale integrated circuit devices. This article describes direct means of enhancing the heat dissipation of such devices in JEDEC (Joint Electron Device Engineering Council) packages by the attachment of a heat sink directly to the bottom of a JEDEC package with solderable heat dissipation pads. This is accomplished by cutting out or building ceramics without the central area of metallized ceramic substrates to allow the heat sink to reach through to make direct contact with a JEDEC package.