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Stress Reduction by Low Temperature Intermetallic Formation

IP.com Disclosure Number: IPCOM000051094D
Original Publication Date: 1982-Aug-01
Included in the Prior Art Database: 2005-Feb-10

Publishing Venue

IBM

Related People

Authors:
Bhattacharya, S Koopman, N Marcotte, VC Strikrishnan, KV [+details]

Abstract

Stress measurements by the semiconductor wafer bowing technique have shown the intermetallic thermal tensile stress, in CuSn contacts for flip-chip solder joints, to be a significant contributor to the total solder bump forces acting on the underlying insulator substrate in the flip-chip joints when employed with CrCuAu contacts and PbSn solder.