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Improved Adhesion of Epoxy Resin to Glass and Silicon

IP.com Disclosure Number: IPCOM000051196D
Original Publication Date: 1982-Aug-01
Included in the Prior Art Database: 2005-Feb-10

Publishing Venue

IBM

Related People

Authors:
Brownlow, JM [+details]

Abstract

In the bonding of epoxy resin to glass, glass fabric and silicon, the problems of water blisters, solder blisters and metal dendrite growth are reduced by the use of an adhesive made by the process of adding with stirring to a first solution of 940 ml H(2)O, 40 ml acetic acid the settled oily fraction (20 ml) of chloropropyltrimethyloxysilane; a second solution of 7,400 ml H(2)O and 100 ml acetic acid, and a third solution of 1,410 ml H(2)O, 60 ml acetic acid and 30 ml vinylbenzylamine. All three solutions are blended and applied to the glass, glass fabric or silicon and dried to form an adhesive film.