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Using A1(2)0(3) for VLSI Multilevel Interconnections

IP.com Disclosure Number: IPCOM000051201D
Original Publication Date: 1982-Aug-01
Included in the Prior Art Database: 2005-Feb-10

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Related People

Ting, CY [+details]


This article relates generally to the fabrication of semiconductor devices and more particularly to a process for achieving high density and multilevel interconnections for VLSI (very large-scale integration) applications.