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Dual-Function Solder Procedure

IP.com Disclosure Number: IPCOM000051335D
Original Publication Date: 1981-Jan-01
Included in the Prior Art Database: 2005-Feb-10

Publishing Venue

IBM

Related People

Authors:
Lau, JA Von Voss, WD [+details]

Abstract

In electronic circuit package components of the flat pack and lead fram types, the input/output (I/O) leads are connected by a common frame-like member. This member, known as a selvage strip, is usually made of the same material stock as the leads. It maintains the positions of the leads in the same plane and in alignment during subsequent processing of the component preparatory to the bonding of the component leads to the compatibly registered printed circuit (PC) pads of the PC board or card to which the component is to be mounted. The current practice is to remove the selvage strip just prior to the lead/pad bonding operation, as it has been found to be more expensive and complex to remove the selvage strip after the bonding operation.