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High Creep Strength Alloy

IP.com Disclosure Number: IPCOM000051336D
Original Publication Date: 1981-Jan-01
Included in the Prior Art Database: 2005-Feb-10

Publishing Venue

IBM

Related People

Authors:
Chirono, OI Romanosky, RJ [+details]

Abstract

A high creep strength solder alloy system has the following composition Component % By Weight Sn 90 - 96 Bi 1 - 3 Ag 3 - 4 Sb 0.4 - 1.5.