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Intrinsic tensile stresses in nickel layers on molybdenum land areas on ceramic substrates are reduced by forming the nickel layer on a roughened molybdenum surface, as illustrated in Fig. 2.
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Roughened Molybdenum Surface for Crack Free Electroless Nickel Plate
Intrinsic tensile stresses in nickel layers on molybdenum land areas on
ceramic substrates are reduced by forming the nickel layer on a roughened
molybdenum surface, as illustrated in Fig. 2.
In semiconductor package ceramic substrates, and, in particular, multilayer
ceramic substrates, molybdenum conductive lands are used to support and
interconnect several semiconductor devices. Molybdenum lands are used as
seal bands, I/O pads, etc. Intrinsic tensile stresses build up in a nickel layer on
essentially flat molybdenum lands, causing cracking and lifting of the nickel layer,
as depicted in Fig. 1. The problem is particularly troublesome when more than
one metal layer is formed on the molybdenum lands, such as layers of nickel,
gold and solder or braze.
In this technique, protrusions are formed on the molybdenum lands. The
protrusions can be formed by screen printing a molybdenum paste made up of
molybdenum particles of the desired size, i.e., 5 - 10 microns in diameter, without
glass frit on the molybdenum lands either before or after the ceramic green
sheets have been laminated into substrates. After firing, the molybdenum surface
will contain 5 - 10 micron high protrusions and little or no glass since the printed
layer of large separate particles contained no glass frit.
As an alternative, the molybdenum lands can be roughened by indenting
recesses or grooves after or while the stack of cerami...