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Etchback Planarization Process

IP.com Disclosure Number: IPCOM000051366D
Original Publication Date: 1981-Jan-01
Included in the Prior Art Database: 2005-Feb-10

Publishing Venue

IBM

Related People

Authors:
Bartush, TA Brooks, GA [+details]

Abstract

A quartz dielectric layer for integrated circuit metallurgy is planarized by a dual-resist coat and plasma etchback process.