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Structure for Enhancing Thermal Nucleation of Semiconductor Devices Disclosure Number: IPCOM000051389D
Original Publication Date: 1981-Jan-01
Included in the Prior Art Database: 2005-Feb-10

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Frieser, RG Gregor, LV Reeber, MD [+details]


A sintered layer of glass or ceramic on the back side of a solder-bonded chip immersed in a cooling liquid provides a nucleating surface that significantly improves cooling efficiency.