Browse Prior Art Database

Structure for Enhancing Thermal Nucleation of Semiconductor Devices

IP.com Disclosure Number: IPCOM000051389D
Original Publication Date: 1981-Jan-01
Included in the Prior Art Database: 2005-Feb-10

Publishing Venue

IBM

Related People

Authors:
Frieser, RG Gregor, LV Reeber, MD [+details]

Abstract

A sintered layer of glass or ceramic on the back side of a solder-bonded chip immersed in a cooling liquid provides a nucleating surface that significantly improves cooling efficiency.