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Center Post Heat Sink

IP.com Disclosure Number: IPCOM000051617D
Original Publication Date: 1981-Feb-01
Included in the Prior Art Database: 2005-Feb-10

Publishing Venue

IBM

Related People

Authors:
Nutter, SW Schmidt, RR Simons, RE [+details]

Abstract

A conventional heat sink design (Fig. 1) includes a folded-fin heat si 1 bonded to a ceramic cap 2. The primary thermal path in this design is from the back side of a chip 3 through a viscous thermal compound 4 to the ceramic cap. Chip 3 is mounted on a substrate 5. The heat must spread radially in cap 2 and in the base of heat sink 1 to get to the cooling fins. This spreading offers significant thermal resistance due to the length of the spreading path, the relatively poor conductivity of the ceramic cap, and the thinness of the heat sink base.