Method for Magnetically Assisted Sputter Etching and Deposition
Original Publication Date: 1981-Feb-01
Included in the Prior Art Database: 2005-Feb-10
The use of magnetic fields in sputter deposition is well known. T application of a transverse magnetic field to a conventional planar diode sputter geometry produces a considerable increase in ionization and rate; however, the discharge is swept to one side and the deposition pattern and target etch profile is very nonuniform.