Browse Prior Art Database

Cryo Panel Heat Absorber to Enhance Wafer Cooling During Ion Implantation

IP.com Disclosure Number: IPCOM000051765D
Original Publication Date: 1981-Mar-01
Included in the Prior Art Database: 2005-Feb-10

Publishing Venue

IBM

Related People

Authors:
Bayer, EH Kranik, JR Mueller, WF [+details]

Abstract

The ion-implant arrangement described provides a cryo-cooled heatsink i close proximity to either the surface of a wafer or the wafer-back, keeping the temperature of the wafer within ""safe'' limits during ion bombardment. Since most of the heat transfer in vacuum is achieved by radiation, it is essential to provide a surface to which the heat can radiate, preferentially, and then remove the heat rapidly by cooling.