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High Temperature Coupling Agents as Adhesion Promoters

IP.com Disclosure Number: IPCOM000051766D
Original Publication Date: 1981-Mar-01
Included in the Prior Art Database: 2005-Feb-10

Publishing Venue

IBM

Related People

Authors:
Anderson, HR Eib, NK Mittal, KL [+details]

Abstract

Phenylsilanes are useful adhesion promoters for dielectric resin layers which must be cured at high temperatures.