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A piezoelectric transducer is bonded to the glass print head of an ink jet printer and encapsulated for environmental protection with an ink resistant film in one processing operation.
English (United States)
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Bonding and Encapsulation of Ceramic Wafer
A piezoelectric transducer is bonded to the glass print head of an ink jet
printer and encapsulated for environmental protection with an ink resistant film in
one processing operation.
The piezoelectric transducer 10 is pre-assembled with the glass print head 12
and a suitable protective film 14, such as a polyimide film, in a spaced-apart
configuration by spacer shims 16. A low viscosity adhesive 18 is applied at the
edge of the pre-assembled components, and the adhesive flows between the
parts until it reaches the edge of the protective film, which is cut slightly larger
than the piezoelectric transducer.
This bonding technique provides complete encapsulation of the piezoelectric
transducer with a thin uniform repeatable bond line of low mass to produce
uniform transducer response. The polyimide film, which covers the surface of the
transducer, provides excellent environmental protection.
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