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Bonding and Encapsulation of Ceramic Wafer

IP.com Disclosure Number: IPCOM000051834D
Original Publication Date: 1981-Mar-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Feulner, RA Hawkins, CR [+details]

Abstract

A piezoelectric transducer is bonded to the glass print head of an ink jet printer and encapsulated for environmental protection with an ink resistant film in one processing operation.