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Process for Batch Cleaving GaAs and Similar Materials

IP.com Disclosure Number: IPCOM000051876D
Original Publication Date: 1981-Mar-01
Included in the Prior Art Database: 2005-Feb-11

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Potemski, RM Small, MB [+details]


Batch cleaving of GaAs wafers and similar materials may be done by scribing the wafer surface and then controllably bending the wafer so that it fractures along the scribe lines.