Browse Prior Art Database

Process for Batch Cleaving GaAs and Similar Materials

IP.com Disclosure Number: IPCOM000051876D
Original Publication Date: 1981-Mar-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Potemski, RM Small, MB [+details]

Abstract

Batch cleaving of GaAs wafers and similar materials may be done by scribing the wafer surface and then controllably bending the wafer so that it fractures along the scribe lines.