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Multilayer Packaging Using Resist Layers

IP.com Disclosure Number: IPCOM000051877D
Original Publication Date: 1981-Mar-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Grobman, WD [+details]

Abstract

A multilevel conductor interconnection structure is described in which resist layers are used not only as the means for defining a conductor layer connection to an underlying structure (e.g., via connections) but also as the insulation layer between the underlying structure and the conductor layer.