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Reflecting Thermal Layer for Magnetic Bubble Devices

IP.com Disclosure Number: IPCOM000051887D
Original Publication Date: 1981-Mar-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Almasi, GS [+details]

Abstract

Magnetic bubble chips often contain a continuous metallic film located between the garnet bubble domain film and the device pattern used to move the bubble. This metallic layer improves bubble visibility during device development and testing, and also provides better thermal distribution in packaged devices. An insulating layer, such as SiO(2), prevents electrical shorting of the control conductors by the underlying metal sheet. However, as bubble domains are scaled down in size, the SiO(2) thickness is also scaled down, and the number of pinholes and electrical shorts increases. Silicon can be a reflecting insulator, but reproducibility of its thickness and optical constants is a problem.