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Browse Prior Art Database

Photoactive Polyimide

IP.com Disclosure Number: IPCOM000051888D
Original Publication Date: 1981-Mar-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Blakeslee, MC [+details]

Abstract

Polyimide is a dielectric material used in the fabrication of microelectronic device structures. In order to form patterns or vias in it, a secondary photoresist mask or an intermediate metal mask (which is itself patterned by a photoresist mask) is required.