Stacked Thermally Enhanced High Package Density Module
Original Publication Date: 1981-Apr-01
Included in the Prior Art Database: 2005-Feb-11
This article describes a stacked, thermally enhanced high density module. As shown in the figure a ceramic substrate 10 is provided which has a plurality of metal-filled vias 12 connected to metallized circuitry 14 on the lower side of the substrate.