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Stacked Thermally Enhanced High Package Density Module

IP.com Disclosure Number: IPCOM000051912D
Original Publication Date: 1981-Apr-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Marks, R Noth, R Phelps, D Samuelsen, S Ward, WC [+details]

Abstract

This article describes a stacked, thermally enhanced high density module. As shown in the figure a ceramic substrate 10 is provided which has a plurality of metal-filled vias 12 connected to metallized circuitry 14 on the lower side of the substrate.