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Use of Extended Swaged Pins for Stacking Disclosure Number: IPCOM000051914D
Original Publication Date: 1981-Apr-01
Included in the Prior Art Database: 2005-Feb-11

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DiCicco Pierce, S Sommer, G [+details]


This article describes the use of swaged pins in a stacked ceramic substrate module used to mount semiconductor chips. In the figure, a ceramic substrate 10 is shown which can mount one or more semiconductor chips (not shown) on the upper surface. The substrate 10 has metal-filled vias 12 each of which terminates in a junction end 14.