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Means of Attaching a Heat Sink to a Module Disclosure Number: IPCOM000051920D
Original Publication Date: 1981-Apr-01
Included in the Prior Art Database: 2005-Feb-11

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Related People

Kilburn, RF Neumann, EW [+details]


In the advanced technology of integrated circuits large amounts of heat have to be dissipated. One conventional manner of dissipating heat is by securing a heat sink to the module cover. An improved technique for attaching the heat sink to the module cover is shown above.