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This article describes an improved thermal clip for use with convention substrates mounting chips and caps therefor.
English (United States)
This text was extracted from a PDF file.
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100% of the total text.
Page 1 of 2
Module Thermal Clip
This article describes an improved thermal clip for use with convention
substrates mounting chips and caps therefor.
Fig. 1 shows an exploded perspective view of a substrate 10 mounting
semiconductor chips 12 thereon, a conventional cap 14 and the improved
thermal clip 16. The clip 16 is formed from a sheet of thermally conductive
resilient material. The sheet of material 16 has a plurality of downwardly
extending resilient fingers 18 stamped therein. The fingers 18 are arranged so
that each overlies and contacts one of the chips 12 when the chip is assembled
together with the cap 14 and substrate 10, as shown in Fig. 2. The flat end
portion of each finger 18 touches its respective chip, and the sheet 16 is in
contact with the cap 14. If desired, the sheet 16 may be crimped around the
edge, as shown at 20, to provide a good snug fit.
With this technique, a single size and configuration of material can be used
for each standard size cap, with the number and position of the fingers being
varied to conform to various chip arrangements on substrates.
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