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Dendritic Heat Sink

IP.com Disclosure Number: IPCOM000051922D
Original Publication Date: 1981-Apr-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Buller, ML Ward, WC [+details]

Abstract

The present article describes a heat sink for the caps of module packag As shown in the single figure, a plurality of stranded wires 10 are each secured at one end to the cover 12 of a module assembly, preferably by welding or brazing. The wires are of a high heat conducting material. The stranded structure of each of the stranded wires is untwisted, or splayed, to form a dendritic-like structure. This will provide an effective heat dissipation source.