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This process provides a cleaner and more active molybdenum surface for nickel deposition.
English (United States)
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Process for Cleaning and Activating Molybdenum for Electroless Nickel
This process provides a cleaner and more active molybdenum surface for
In ceramic packaging technology, particularly multilayer ceramic packages,
molybdenum pads are formed on the surface of the substrate. After sintering,
additional metal layers are deposited on the molybdenum pads. One such metal
layer is nickel deposited by electroless deposition techniques. This requires that
the molybdenum pads be properly cleaned and activated.
In this process, the substrates containing the molybdenum pads are given a
dip in PdCl(2) to activate the molybdenum, and subsequently rinsed in a solution
of approximately 10% by volume concentrated NH(4)OH, followed by a running
rinse. This process places the molybdenum pad in condition for electroless
plating by removing MoO(3) from the surface and raising the electrochemical
potential of the activated molybdenum.