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Ion Milling Technique to Reflow Solder Pads

IP.com Disclosure Number: IPCOM000051952D
Original Publication Date: 1981-Apr-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Herdzik, RJ Sarkary, HG Totta, PA [+details]

Abstract

The procedure here for fluxless solder mound reflow comprises ion milli solder pads long enough to remove surface oxides, which now removed and while still in the vacuum chamber, the stage on which the wafers are mounted on is heated to a temperature high enough to reflow solder pads. The environment during reflow could vary; it could be a vacuum, hydrogen or an inert atmosphere. The advantage of this reflow procedure, without flux and oxide-free, is due to ion milling solder oxides.