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Ion Milling to Remove Halo

IP.com Disclosure Number: IPCOM000051954D
Original Publication Date: 1981-Apr-01
Included in the Prior Art Database: 2005-Feb-11

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Herdzik, RJ Sarkary, HG Totta, PA [+details]


Wafers in process that have contact pads, for solder mounds, especially in close proximity to one another can develop shorts or leakage paths because evaporant is deposited under the evaporant mask. This problem becomes serious when contact spacing is minimal.