Four Point Probe for Peripheral Brazed Pins
Original Publication Date: 1981-Apr-01
Included in the Prior Art Database: 2005-Feb-11
In-situ electrical testing of pin substrate joints is currently very difficult. Broken pins occurring during card assembly and final card processing are a significant multilayer ceramic (MLC) problem. It is often difficult to electrically isolate and verify the loose pin unless the module is removed from the card. In the vast majority of these cases, the broken pin is on a corner or outer row.