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Discussed is a technique for the reduction of MCM (multi-chip module) pin damage from thermal excursions or mechanical damage.
English (United States)
This text was extracted from a PDF file.
This is the abbreviated version, containing approximately
90% of the total text.
Page 1 of 1
Protective Layer for Multilayer Ceramic I/O Pins
Discussed is a technique for the reduction of MCM (multi-chip module) pin
damage from thermal excursions or mechanical damage.
This technique comprises applying a layer of KEVLAR*/polymide- or
KEVLAR/epoxy-coated laminate to the bottom (I/O) side of substrates after pins
The thermal expansion properties of the laminates can be matched to those
of the Al(2)O(3) substrate. This layer would prevent mechanical and thermal
damage during the processing and subsequent thermal cycle damage during
machine use in the field.
The cured laminate would move the primary stress/strain point from the
pin/braze connection to the stronger pin shank.
The KEVLAR pre-preg or laminate can be trimmed, and the pin holes opened
with a laser. After applying the sheet to the substrate, a curing cycle allows the
laminate/epoxy to flow and bond to the Al(2)O(3) surface and seal the pin/braze
connection from external environments and stresses.
The KEVLAR laminate can be constructed in several ways. 1. Pre-pregnated
sheets laid up to the required thickness and cured in place on the substrate. 2. A
laminate of several KEVLAR layers with a layer of uncured epoxy on the
substrate side. This type would handle easier handle easier and, cured in place,
would allow the epoxy to fill in the pin holes, flow around the pin
Several types of pin holes can be obtained with the laser:
1. Oversized - to clear the entire pin/braze area.