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Protective Layer for Multilayer Ceramic I/O Pins

IP.com Disclosure Number: IPCOM000051957D
Original Publication Date: 1981-Apr-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Ricker, MW Zanin, SJ [+details]

Abstract

Discussed is a technique for the reduction of MCM (multi-chip module) pin damage from thermal excursions or mechanical damage.