Browse Prior Art Database

Thermally Enhanced Single Chip Module

IP.com Disclosure Number: IPCOM000051958D
Original Publication Date: 1981-Apr-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Goldmann, LS [+details]

Abstract

A number of semiconductor packaging designs [*] use thermal grease to transfer heat from chip to (alumina) cap, solder seal, and standoffs in the preform to maintain separation. The underside of the hat is ground to insure the distance 6, as in Fig. 1A. During assembly, a load is applied to the hat to insure leveling (Fig. 1B).