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Metallization and Isolation for Bipolar Devices

IP.com Disclosure Number: IPCOM000051959D
Original Publication Date: 1981-Apr-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Malaviya, SD [+details]

Abstract

The process described here self-aligns metal over device contacts as well as eliminates juxtaposition of N/+/ subcollector and P/+/ isolation, thereby reducing collector-isolation capacitance.