Quench Test for Ascertaining Quartz Cracking Susceptability
Original Publication Date: 1981-Apr-01
Included in the Prior Art Database: 2005-Feb-11
The approach here for ascertaining quartz (coated on semiconductor wafers)-cracking susceptibility, comprises subjecting a wafer through a H(2) reflow cycle after CrCuAu land deposition prior to PbSn solder mound evaporation and subsequent quartz crack inspection. For very crack-sensitive wafers such as the wafers with sharp-edged metallurgy, thermal treatment provided in the reflow cycle is sufficient to cause quartz cracking, which has been observed.