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Browse Prior Art Database

Module Sealing Technique

IP.com Disclosure Number: IPCOM000052014D
Original Publication Date: 1981-Apr-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Shepheard, RG [+details]

Abstract

This technique prevents sealant 10 from penetrating and running into th interior surface 14 of the module containing the chips 16. Modules are sealed by first placing a bead of the sealant 10 between the cap 18 and the edge 20 of the substrate, the amount of sealant being just sufficient to fill the space between the cap and the substrate. A small orifice dispense needle can be used to dispense the sealant 10. The sealant should then be allowed or induced to solidify sufficiently to form a seal; after that, the entire back of the module can be covered with the sealant 10 In the conventional manner.