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We have developed a technique to remove the hard film of rhodium oxide and then plate copper over screen conductors using an alkaline plating bath. This provides a desirable tinning characteristic.
English (United States)
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Plating and Tinning Technique for Screened Rh Conductors
We have developed a technique to remove the hard film of rhodium oxide
and then plate copper over screen conductors using an alkaline plating bath.
This provides a desirable tinning characteristic.
It is accomplished by the following steps: 1) The parts are cleaned thoroughly
in tribasic sodium phosphate solution using mild ultrasonic at about 65 degrees
C, followed by rinsing and drying. Immediately, they must be cleaned in solvent
at about 55 degrees C using mild ultrasonic. 2) All the contacts must be shorted
together at the end opposite to the terminals. This is accomplished by using Ag
conductive epoxy or a 100% metal contact, such as sputtered metal. 3)
Electrochemically etch rhodium oxide using 4% KOH solution (weight percent) at
6 V for 5 minutes. It will remove the film of rhodium oxide, leaving behind a fresh
layer of rhodium. 4) Rinse parts in deionized water and perform electroplating for
copper using copper pyrophosphate bath. The current density is 24 APF, the pH
is maintained at 8.3, and the operating temperature is 40/45 degrees C. Plating
must be carried out for 6 to 8 minutes. 5) Rinse and dry the parts. 6) Tin pads
using eutectic solder and active flux.