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Module Construction For Very High Volume Packaging Density

IP.com Disclosure Number: IPCOM000052090D
Original Publication Date: 1981-Apr-01
Included in the Prior Art Database: 2005-Feb-11

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Tsui, F [+details]


This article relates to the structure of a module which permits a very high volume-packaging density to be achieved. The resulting module is applicable to Josephson circuitry as well as semiconductor and other technologies.