Dismiss
The InnovationQ application will be updated on Sunday, May 31st from 10am-noon ET. You may experience brief service interruptions during that time.
Browse Prior Art Database

Nondestructive Chemical Removal of Encapsulants used in Semiconductor Packaging

IP.com Disclosure Number: IPCOM000052120D
Original Publication Date: 1981-May-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Clark, RJ Hammond, B [+details]

Abstract

A composition and method for removing silicone oils, greases, gels or organic epoxies is described.