Browse Prior Art Database

Top Seal Composition for Silicon to Ceramic Solder Connectors

IP.com Disclosure Number: IPCOM000052136D
Original Publication Date: 1981-May-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Joseph, CA [+details]

Abstract

In electronic packaging techniques there is a need to adequately cover and protect complex solder connector patterns under an attached chip. Some difficulty has been experienced, in particular, in attempting to protect solder-ball connectors under a silicon chip which is attached thereby to a ceramic base.