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Top Seal Composition for Silicon to Ceramic Solder Connectors Disclosure Number: IPCOM000052136D
Original Publication Date: 1981-May-01
Included in the Prior Art Database: 2005-Feb-11

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Joseph, CA [+details]


In electronic packaging techniques there is a need to adequately cover and protect complex solder connector patterns under an attached chip. Some difficulty has been experienced, in particular, in attempting to protect solder-ball connectors under a silicon chip which is attached thereby to a ceramic base.