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Polyimide Pre Coating of Substrates

IP.com Disclosure Number: IPCOM000052141D
Original Publication Date: 1981-May-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Anderson, GE [+details]

Abstract

A polyimide film placed on fine-line technology substrates prior to metallization provides more uniform covering of the metallurgy due to an improved surface profile. When combined with varied deposition rates, the coating will produce better grain size, and grain boundaries, and enhance etching.