Polyimide Coating for Ceramic Substrates
Original Publication Date: 1981-May-01
Included in the Prior Art Database: 2005-Feb-11
Screened polyimide coatings can be used as solder dams and protective overcoatings of circuits on metallized ceramic substrates. This procedure eliminates the need for a top chromium layer and second-pass photographic and etching operations. The coating acts as an insulator between the substrate edge and cover, and makes available additional area for circuit layout outside the module pin cage.