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Polyimide Coating for Ceramic Substrates

IP.com Disclosure Number: IPCOM000052142D
Original Publication Date: 1981-May-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Anderson, GE [+details]

Abstract

Screened polyimide coatings can be used as solder dams and protective overcoatings of circuits on metallized ceramic substrates. This procedure eliminates the need for a top chromium layer and second-pass photographic and etching operations. The coating acts as an insulator between the substrate edge and cover, and makes available additional area for circuit layout outside the module pin cage.