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Copper Cleaning Process

IP.com Disclosure Number: IPCOM000052144D
Original Publication Date: 1981-May-01
Included in the Prior Art Database: 2005-Feb-11

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Blumberg, LR Hanford, DE Samuelson, CE [+details]


Adhesion of aqueous photoresist is promoted by giving copper-clad panel a chemical and mechanical microetch in the cleaning process prior to photoresist application. Cupric chloride, hydrochloric acid, and a 320 grit brush are utilized to prepare the panel for photoresist application and also to remove the protective chrome coating frequently applied upon manufacture to prevent oxidation of the copper during shipment and storage.