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Ammonia Peroxydisulfate Regeneration using Ammonia Gas

IP.com Disclosure Number: IPCOM000052150D
Original Publication Date: 1981-May-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Griffith, JH [+details]

Abstract

Plasma display fabrication technology requires extremely tight tolerances in etching copper thin film in order to meet luminescence and electronic specifications. Ammonium peroxydisulfate etchant, because of its uniform etching properties, is used in this technology. The chemical reaction responsible for etching of copper by ammonia peroxydisulfate is given by the following reaction: See Original p5332