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Contamination and Suppressor Shields

IP.com Disclosure Number: IPCOM000052159D
Original Publication Date: 1981-May-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Dahlke, GP Lupul, FT Martin, HJ Wurms, C [+details]

Abstract

In noting that contamination is a factor during sputter cleaning in a conventional in-situ RF A1/Cu system, it was observed that a glow was present behind the old type top shield and secondary sputtering was causing additional unwanted heat, and forming sputtered deposits which caused contamination to the product and the vacuum system.