High Performance Single Chip Module
Original Publication Date: 1981-May-01
Included in the Prior Art Database: 2005-Feb-11
Bonding pads on an integrated circuit chip are connected to closely spaced bonding pads on the underside of a multiple layer ceramic substrate, rather than to more widely spaced areal pins on the substrate, in order to reduce the size of single-chip modules. This results in improved electrical performance as well as increased packaging density, thus yielding faster central processor cycle time at the system level.