Browse Prior Art Database

High Performance Single Chip Module

IP.com Disclosure Number: IPCOM000052166D
Original Publication Date: 1981-May-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Feinberg, I Kumar, VR [+details]

Abstract

Bonding pads on an integrated circuit chip are connected to closely spaced bonding pads on the underside of a multiple layer ceramic substrate, rather than to more widely spaced areal pins on the substrate, in order to reduce the size of single-chip modules. This results in improved electrical performance as well as increased packaging density, thus yielding faster central processor cycle time at the system level.