Browse Prior Art Database

High Performance Single Chip Module Disclosure Number: IPCOM000052166D
Original Publication Date: 1981-May-01
Included in the Prior Art Database: 2005-Feb-11

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Feinberg, I Kumar, VR [+details]


Bonding pads on an integrated circuit chip are connected to closely spaced bonding pads on the underside of a multiple layer ceramic substrate, rather than to more widely spaced areal pins on the substrate, in order to reduce the size of single-chip modules. This results in improved electrical performance as well as increased packaging density, thus yielding faster central processor cycle time at the system level.