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Conduction Cooling Structure for a Semiconductor Package

IP.com Disclosure Number: IPCOM000052188D
Original Publication Date: 1981-May-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Abstract

This structure provides large area contact between the backside of a solder-bonded integrated circuit device and a conduction cooling element This reduces the thermal resistance and increases the cooling efficiency