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This structure provides large area contact between the backside of a solder-bonded integrated circuit device and a conduction cooling element This reduces the thermal resistance and increases the cooling efficiency
English (United States)
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Conduction Cooling Structure for a Semiconductor Package
This structure provides large area contact between the backside of a solder-
bonded integrated circuit device and a conduction cooling element This reduces
the thermal resistance and increases the cooling efficiency
It is conventional to provide a spring-biased piston to conduct heat from a
device to a cold plate, as described in U.S. Patent 3,993,123. However, when a
device is tilted relative to the bottom surface of the piston, the area of contact is
only a point or, at best, a line. This lack of a large area contact increases the
thermal resistance which reduces cooling efficiency.
In this cooling structure a bendable spring-biased conduction element 10 is
provided to remove heat generated in semiconductor device 12 and conduct the
heat to cooling plate 14. Semiconductor device 12 is mounted on substrate 16
by solder bonds 18. Element 10, shown more clearly in Figs. 2 and 3, consists of
a flat piece of metal provided with two spaced depressions 20 and 22 that divide
the sheet into a central portion 24 and two legs 26. As more clearly shown in
Fig. 1, the element 10 is bent into a U-shaped configuration on recesses 20 and
22 and the legs 26 inserted into slots 28 formed in cooling plate 14. A spring 30
biases the central portion 24 into contact with device 12. The cooling structure is
adapted to accommodate a tilted chip, as illustrated in the left side of Fig. 1
because the element 10 will bend at the re...