Browse Prior Art Database

Shock Proof Module Package

IP.com Disclosure Number: IPCOM000052230D
Original Publication Date: 1981-May-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Cioffi, JM Hatsios, JG McDonald, JA [+details]

Abstract

This package minimizes electrical and mechanical shock to a circuit module.