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Edge Mounted MLC Packaging Scheme

IP.com Disclosure Number: IPCOM000052286D
Original Publication Date: 1981-May-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Gegenwarth, RE Hammer, R Proto, GR [+details]

Abstract

For greater cooling capacity, higher density or increased wiring flexibility, it is often advantageous to run electrical circuitry on orthogonal planes in either a monolithic structure or by connecting separate parts with pins, leads, solder connections, etc. Ideally, for structural strength, the parts should be mechanically fastened as well as electrically connected.