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Process for Producing Palladium Structures

IP.com Disclosure Number: IPCOM000052312D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Armstrong, EJ Sirsen, JM [+details]

Abstract

Pad-on-pad connectors utilizing low voltage and low contact pressure employ rough contact surfaces to provide and insure sufficient wipe of the contact surfaces as they are mated. Ideally, the contact surfaces should consist of many strong finger-like structures which would intermesh and wipe each other as mating occurred.