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Browse Prior Art Database

Reverse Pin Guidance System

IP.com Disclosure Number: IPCOM000052313D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Babuka, R Callaway, RW Tomaine, L [+details]

Abstract

In circuit packaging technology, a printed circuit board/TCCM (thermal compression cooled module) connector Guidance system consists of precision pins retained in the TCCM module which are inserted into slots within the spring array carrier (fastened to the PC board stiffener) during module insertion. Spring clips are then attached to the TCCM module (for retention purposes), and the module is then side actuated into position by the use of an eccentric cam tool. It was found that, due to excess module freedom during insertion, a potential interference condition existed between the module pins and the spring contacts and/or the board spring array carrier. This condition resulted in the deformation of spring contacts and/or bending of module pins.