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Multilayer IC Substrate System

IP.com Disclosure Number: IPCOM000052314D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Darrow, RE Funari, J Tomek, RE [+details]

Abstract

In this system, Au is used instead of Cr for the top metal layer of an internal plane of a multiplanar, i.e., multilayer, integrated circuit (IC) substrate.