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MC Substrate Pre Cleaning Process

IP.com Disclosure Number: IPCOM000052316D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Rivenburgh, DL Thomas, GM [+details]

Abstract

During the process steps before tinning, such as photolith, pinning, inspection, shearing, etc., the metallized ceramic substrates are handled a number of times. During this handling, the substrates become contaminated with a number of ionic contaminants, such as chlorides, etc. The normal perchlor pre-cleaning process does not remove these ionic contaminants. Therefore, during the subsequent tinning operation, the chlorides etc., attack the chrome barrier of the circuitry. This condition is especially acute on fine line circuit substrates.