Browse Prior Art Database

Baking Photoresist to Improve Adhesion

IP.com Disclosure Number: IPCOM000052317D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11

Publishing Venue

IBM

Related People

Authors:
Pernes, RJ Shipley, JF [+details]

Abstract

During the fabrication of printed circuit boards, a layer of photosensitive material is laminated to the circuit board. In the generally used process, after the photosensitive material is applied to the circuit board, it is exposed and developed.