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Baking Photoresist to Improve Adhesion Disclosure Number: IPCOM000052317D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11

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Related People

Pernes, RJ Shipley, JF [+details]


During the fabrication of printed circuit boards, a layer of photosensitive material is laminated to the circuit board. In the generally used process, after the photosensitive material is applied to the circuit board, it is exposed and developed.